
Apple, Broadcom sign US$30bn+ chip agreement

Apple Inc has unveiled a new multiyear agreement with longtime chip supplier Broadcom Inc worth more than US$30 billion (A$43 billion). The deal deepens the iPhone maker’s investment in U.S. semiconductor manufacturing and is the largest commitment under its American Manufacturing Program (AMP) initiative to lift production in the United States of key Apple components. Under the agreement announced on Wednesday, Broadcom will design and produce custom silicon components and advanced wireless connectivity technologies for Apple products, with more than 15 billion chips to be made in the U.S. by 2031. It also includes a $1.5 billion expansion and modernisation of Broadcom's manufacturing facility in Fort Collins, Colorado. "Apple and Broadcom have a long history together, and this new phase of our partnership further accelerates our commitment to American manufacturing and innovation," Apple Chief Executive Tim Cook said in a news release. He said Apple was proud to deepen its investments in U.S.-based suppliers that shared its commitment to excellence and innovation with the components to be built in Fort Collins essential to delivering the performance and connectivity customers expected. "Broadcom is proud to con







